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Datasheets and Reference Manuals

Cougar MI0502 Datasheet

MI0502Mxxxx (updated 2026 March)

 

USB Interface Communication Protocol

Application-level communication protocol between host system and the MI49. It relies on a command-acknowledge type of exchange. The document describes the message format and suggested algorithm, as well as reference implementations.

Software

Evaluation Kit GUI for Windows (updated 2025-07-29)

Connects to the Evaluation Kit via USB and enables interaction with the camera module and thermal imaging processor. For Windows 7, please download the USB driver below.

Evaluation Kit GUI USB Driver for Windows 7

Enables the EVK GUI software to work on Windows 7.

 

Application Notes

Enabling of Compensated Thermal Data on MI48

When Compensated Data is output by MI48, the Host Microcontroller performing the readout must convert that data to temperature. This enables the use of alternative look-up table that may provide better accuracy in a specific application.

Colour map

How to represent temperature data frame as a colour map (aka heatmap)?

Performance verification (updated 2023-01-17)

How to check the accuracy of individual modules against a reference blackbody.

Product-level and unit-level calibration (2023-05-22)

When the MI0802 is used in an application where not just thermal contrast is needed, but absolute temperature values are important, it may be useful to verify and fine-tune the performance either per product (product-level calibration) or per individual module (unit-level calibration).

Using Protective Windows (2023-01-03)

Many applications require protection of the lens of the thermal imager from the actual environment of the objects of interest. The use of a protective window compromises the calibration accuracy of the temperature readout. In this application note, we discuss compensatory mechanisms that allow us to estimate the correct temperature of the object even with a protective window.

Heat Management Strategies (2024-12-23)

Improve temperature accuracy by minimize heat transfer from heat sources to sensor module

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